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* Merge branch 'fixes' of ↵Zhang Rui2014-12-211-1/+1
|\ | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
| * thermal: Fix cdev registration with THERMAL_NO_LIMIT on 64bitPunit Agrawal2014-12-101-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The size of unsigned long varies between 32 and 64 bit systems while the size of phandle arguments is always 32 bits per parameter. On 64-bit systems, cooling devices registered via of-thermal apis fail to bind when the min/max cooling state is specified as THERMAL_NO_LIMIT (-1UL) as there is a mis-match between the value read from the device tree (32bit) and the pre-processor define (64bit). As we're unlikely to need cooling states larger than 32 bits, and for consistency with the size of phandle arguments, explicitly limit THERMAL_NO_LIMIT to 32 bits. Reported-by: Hyungwoo Yang <hwoo.yang@gmail.com> Acked-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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*-. | Merge branches 'thermal-core-fix', 'thermal-soc' and 'thermal-int340x' into nextZhang Rui2014-12-131-6/+36
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| * | thermal: of: Extend current of-thermal.c code to allow setting emulated tempLukasz Majewski2014-12-091-0/+3
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Before this change it was only possible to set get_temp() and get_trend() methods to be used in the common code handling passing parameters via device tree to "cpu-thermal" CPU thermal zone device. Now it is possible to also set emulated value of temperature for debug purposes. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Acked-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * | thermal: of: Rename struct __thermal_trip to struct thermal_tripLukasz Majewski2014-12-081-0/+15
| | | | | | | | | | | | | | | | | | | | | | | | This patch changes name of struct __thermal_trip to thermal_trip and moves declaration of the latter to ./include/linux/thermal.h for better visibility. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
| * | thermal: of: improve of-thermal sensor registration APIEduardo Valentin2014-11-201-6/+18
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Different drivers request API extensions in of-thermal. For this reason, additional callbacks are required to fit the new drivers needs. The current API implementation expects the registering sensor driver to provide a get_temp and get_trend callbacks as function parameters. As the amount of callbacks is growing, this patch changes the existing implementation to use a .ops field to hold all the of thermal callbacks to sensor drivers. This patch also changes the existing of-thermal users to fit the new API design. No functional change is introduced in this patch. Cc: Alexandre Courbot <gnurou@gmail.com> Cc: devicetree@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Guenter Roeck <linux@roeck-us.net> Cc: Jean Delvare <jdelvare@suse.de> Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-tegra@vger.kernel.org Cc: lm-sensors@lm-sensors.org Cc: Rob Herring <robh+dt@kernel.org> Cc: Stephen Warren <swarren@wwwdotorg.org> Cc: Thierry Reding <thierry.reding@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Acked-by: Guenter Roeck <linux@roeck-us.net> Tested-by: Mikko Perttunen <mikko.perttunen@kapsi.fi> Reviewed-by: Mikko Perttunen <mikko.perttunen@kapsi.fi> Reviewed-by: Alexandre Courbot <acourbot@nvidia.com> Reviewed-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
* / thermal: provide an UAPI header fileFlorian Fainelli2014-12-091-30/+1Star
|/ | | | | | | | | | | | | | | | | | include/linux/thermal.h contains definitions for the Thermal generic netlink family, but none of the valuable information relevant to user-space such as the Genl family name, multicast group, version or command set and data types is exported to user-space. Export all the relevant generic netlink information to user-space to make this genl family usable by user-space, and while at it, export THERMAL_NAME_LENGTH since it limits name length for thermal_hwmon devices. Kbuild and MAINTAINERS are also updated accordingly to reflect this new file: include/uapi/linux/thermal.h. Signed-off-by: Florian Fainelli <f.fainelli@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: introduce INT3402 thermal driverAaron Lu2014-10-101-0/+2
| | | | | | | | | | ACPI INT3402 device object could report temperature for the memory module. To expose such information to user space, a thermal zone device is registered for it so that the thermal sysfs interface can expose such information for userspace to use. Signed-off-by: Aaron Lu <aaron.lu@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: move the KELVIN_TO_MILLICELSIUS macro to thermal.hAaron Lu2014-10-101-0/+2
| | | | | | | | | This macro can be used by other component so move it to a common header, but in a slightly different way: define two macros, one macro with an offset and the other doesn't. Signed-off-by: Aaron Lu <aaron.lu@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: document struct thermal_zone_device and thermal_governorJavi Merino2014-07-221-2/+44
| | | | | | | | | | Document struct thermal_zone_device and struct thermal_governor fields and their use by the thermal framework code. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: core: introduce thermal_of_cooling_device_registerEduardo Valentin2013-12-041-0/+4
| | | | | | | | | | | | | | | This patch adds a new API to allow registering cooling devices in the thermal framework derived from device tree nodes. This API links the cooling device with the device tree node so that binding with thermal zones is possible, given that thermal zones are pointing to cooling device device tree nodes. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: introduce device tree parserEduardo Valentin2013-12-041-2/+26
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* thermal: thermal_core: allow binding with limits on bind_paramsEduardo Valentin2013-09-031-0/+10
| | | | | | | | | | | | | | | | When registering a thermal zone device using platform information via bind_params, the thermal framework will always perform the cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT). This patch changes the data structures so that it is possible to inform what are the desired limits for each trip point inside a bind_param. The way the binding is performed is also changed so that it uses the new data structure. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* drivers: thermal: make usage of CONFIG_THERMAL_HWMON optionalEduardo Valentin2013-09-031-0/+8
| | | | | | | | | | | | | | | | | | | | | | When registering a new thermal_device, the thermal framework will always add a hwmon sysfs interface. This patch adds a flag to make this behavior optional. Now when registering a new thermal device, the caller can optionally inform if hwmon interface is desirable. This can be done by means of passing a thermal_zone_params.no_hwmon == true. In order to keep same behavior as of today, all current calls will by default create the hwmon interface. Cc: David Woodhouse <dwmw2@infradead.org> Cc: linux-acpi@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: Zhang Rui <rui.zhang@intel.com> Suggested-by: Wei Ni <wni@nvidia.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Merge branch 'next' of ↵Linus Torvalds2013-05-091-7/+8
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management update from Zhang Rui: "The most important one is to build thermal core and governor and cpu cooling code into one module. This fixes a regression that thermal core does not work if it is built as module, since 3.7. I'll backport them to stable kernel once those changes are in upstream. The largest batch is the thermal kernel-doc & coding style updates/cleanups from Eduardo. Highlights: - build all thermal framework code into one module to fix a regression that thermal does not work if it is built as module. - Marvell Armada 370/XP thermal sensor driver - thermal core/cpu cooling kernel-doc & coding style updates and cleanups. - Add Eduardo Valentin as thermal sub-maintainer, both in mailing list and patchwork. He will help me on arm thermal drivers." * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (68 commits) thermal: db8500_cpufreq_cooling: remove usage of IS_ERR_OR_NULL() thermal: thermal_core: remove usage of IS_ERR_OR_NULL thermal: cpu_cooling: improve line breaking thermal: cpu_cooling: alignment improvements thermal: cpu_cooling: remove checkpatch.pl warning thermal: cpu_cooling: remove trailing blank line thermal: cpu_cooling: align on open parenthesis thermal: cpu_cooling: standardize comment style thermal: cpu_cooling: standardize end of function thermal: cpu_cooling: remove trailing white spaces Thermal: update documentation for thermal_zone_device_register thermal: update kernel-doc for thermal_zone_device_register thermal: update kernel-doc for create_trip_attrs thermal: update kernel-doc for thermal_cooling_device_register thermal: update kernel-doc for thermal_zone_unbind_cooling_device thermal: update kernel-doc for thermal_zone_bind_cooling_device thermal: use EXPORT_SYMBOL_GPL thermal: rename notify_thermal_framework to thermal_notify_framework thermal: update driver license thermal: use strlcpy instead of strcpy ...
| * thermal: rename notify_thermal_framework to thermal_notify_frameworkEduardo Valentin2013-04-241-1/+1
| | | | | | | | | | | | | | | | To follow the prefix names used by the thermal functions, this patch renames notify_thermal_framework to thermal_notify_framework. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: expose thermal_zone_get_temp APIEduardo Valentin2013-04-151-0/+1
| | | | | | | | | | | | | | | | | | | | This patch exports the thermal_zone_get_temp API so that driver writers can fetch temperature of thermal zones managed by other drivers. Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * thermal: introduce thermal_zone_get_zone_by_name helper functionEduardo Valentin2013-04-151-0/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | This patch adds a helper function to get a reference of a thermal zone, based on the zone type name. It will perform a zone name lookup and return a reference to a thermal zone device that matches the name requested. In case the zone is not found or when several zones match same name or if the required parameters are invalid, it will return the corresponding error code (ERR_PTR). Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
| * Merge branch 'thermal' of ↵Zhang Rui2013-04-151-5/+4Star
| |\ | | | | | | | | | | | | | | | | | | git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into next Conflicts: drivers/thermal/cpu_cooling.c
| | * Thermal: build thermal governors into thermal_sys moduleZhang Rui2013-04-141-4/+0Star
| | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
| | * Thermal: exynos: fix cooling state translationZhang Rui2013-03-261-1/+4
| | | | | | | | | | | | | | | Signed-off-by: Zhang Rui <rui.zhang@intel.com> Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>
| * | thermal: Fix compiler warningEzequiel Garcia2013-03-261-1/+1
| |/ | | | | | | | | | | | | | | | | | | | | | | | | | | The following warning is obtained when CONFIG_NET is not defined: In file included from drivers/thermal/mvebu_thermal.c:27:0: include/linux/thermal.h:254:12: warning: 'thermal_generate_netlink_event' defined but not used [-Wunused-function] This patch fixes the warning by properly inlining thermal_generate_netlink_event(). Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* / thermal: shorten too long mcast group nameMasatake YAMATO2013-03-201-1/+1
|/ | | | | | | The original name is too long. Signed-off-by: Masatake YAMATO <yamato@redhat.com> Signed-off-by: David S. Miller <davem@davemloft.net>
* thermal: sysfs: Add a new sysfs node emul_temp for thermal emulationAmit Daniel Kachhap2013-02-061-0/+2
| | | | | | | | | | | | | | | | This patch adds support to set the emulated temperature method in thermal zone (sensor). After setting this feature thermal zone may report this temperature and not the actual temperature. The emulation implementation may be based on sensor capability through platform specific handler or pure software emulation if no platform handler defined. This is useful in debugging different temperature threshold and its associated cooling action. Critical threshold's cannot be emulated. Writing 0 on this node should disable emulation. Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* thermal: Use thermal zone device id in netlink messagesEduardo Valentin2013-01-161-2/+4
| | | | | | | | | | | This patch changes the function thermal_generate_netlink_event to receive a thermal zone device instead of a originator id. This way, the messages will always be bound to a thermal zone. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Reviewed-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Introduce THERMAL_TREND_RAISE_FULL and THERMAL_TREND_DROP_FULLZhang Rui2013-01-041-0/+2
| | | | | | | | | | | These two new thermal_trend types are used to tell the governor that the temeprature is raising/dropping quickly. Thermal cooling governors should handle this situation and make proper decisions, e.g. set cooling state to upper/lower limit directly instead of one step each time. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Fix DEFAULT_THERMAL_GOVERNORZhang Rui2012-12-121-2/+8
| | | | | | | Fix DEFAULT_THERMAL_GOVERNOR to be consistant with the default governor selected in kernel config file. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add a notification APIDurgadoss R2012-11-051-0/+1
| | | | | | | | | This patch adds a notification API which the sensor drivers' can use to notify the framework. The framework then takes care of the throttling according to the configured policy. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Make thermal_cdev_update as a global functionDurgadoss R2012-11-051-0/+1
| | | | | | | | | | This patch makes the thermal_cdev_update function as a global one, so that other files can use it. This function serves as a single arbitrator to set the state of a cooling device. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add thermal governor registration APIsDurgadoss R2012-11-051-0/+16
| | | | | | | | | | This patch creates a structure to hold platform thermal governor information, and provides APIs for individual thermal governors to register/unregister with the Thermal framework. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Pass zone parameters as argument to tzd_registerDurgadoss R2012-11-051-1/+2
| | | | | | | | | This patch adds the thermal zone parameter as an argument to the tzd_register() function call; and updates other drivers using this function. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add platform level information to thermal.hDurgadoss R2012-11-051-0/+29
| | | | | | | | | | This patch adds platform level information to thermal.h by introducing two structures to hold: * bind parameters for a thermal zone, * zone level platform parameters Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Add get trend, get instance API's to thermal_sysDurgadoss R2012-11-051-0/+4
| | | | | | | | | | | This patch adds the following API's to thermal_sys.c, that can be used by other Thermal drivers. * get_tz_trend: obtain the trend of the given thermal zone * get_thermal_instance: obtain the instance corresponding to the given tz, cdev and the trip point. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Refactor thermal.h fileDurgadoss R2012-11-051-35/+43
| | | | | | | | | | | | | | This patch rearranges the code in thermal.h file, in the following order, so that it is easy to read/maintain. 1. All #defines 2. All enums 3. All fops structures 4. All device structures 5. All function declarations Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* Thermal: Introduce locking for cdev.thermal_instances list.Zhang Rui2012-09-241-0/+1
| | | | | | | | | | | | | we need to go over all the thermal_instance list of a cooling device to decide which cooling state to put the cooling device to. But at this time, as a cooling device may be referenced in multiple thermal zones, we need to lock the list first in case another thermal zone is updating this cooling device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Unify the code for both active and passive coolingZhang Rui2012-09-241-1/+1
| | | | | | | | | | Remove thermal_zone_device_passive(). And use thermal_zone_trip_update() and thermal_zone_do_update() for both active and passive cooling. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Introduce simple arbitrator for setting device cooling stateZhang Rui2012-09-241-0/+1
| | | | | | | | | | | | | | | | | This fixes the problem that a cooling device may be referenced by by multiple trip points in multiple thermal zones. With this patch, we have two stages for updating a thermal zone, 1. check if a thermal_instance needs to be updated or not 2. update the cooling device, based on the target cooling state of all its instances. Note that, currently, the cooling device is set to the deepest cooling state required. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: List thermal_instance in thermal_cooling_device.Zhang Rui2012-09-241-0/+1
| | | | | | | | | | List thermal_instance in thermal_cooling_device so that cooling device can know the cooling state requirement of all the thermal instances. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Rename thermal_zone_device.cooling_devicesZhang Rui2012-09-241-2/+2
| | | | | | | | | | | | Rename thermal_zone_device.cooling_devices to thermal_zone_device.thermal_instances thermal_zone_device.cooling_devices is not accurate as this is a list for thermal instances, rather than cooling devices. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Thermal: Remove tc1/tc2 in generic thermal layer.Zhang Rui2012-09-241-4/+1Star
| | | | | | | | | Remove tc1/tc2 in generic thermal layer. .get_trend() callback starts to take effect from this patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
* Thermal: Introduce .get_trend() callback.Zhang Rui2012-09-241-0/+9
| | | | | | | | | | | | | | | | | | | | | According to ACPI spec, tc1 and tc2 are used by OSPM to anticipate the temperature trends. We introduced the same concept to the generic thermal layer for passive cooling, but now it seems that these values are hard to be used on other platforms. So We introduce .get_trend() as a more general solution. For the platform thermal drivers that have their own way to anticipate the temperature trends, they should provide their own .get_trend() callback. Or else, we will calculate the temperature trends by simply comparing the current temperature and the cached previous temperature reading. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
* Thermal: set upper and lower limitsZhang Rui2012-09-241-1/+4
| | | | | | | | | set upper and lower limits when binding a thermal cooling device to a thermal zone device. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl> Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
* Merge tag 'for-v3.6' of git://git.infradead.org/battery-2.6Linus Torvalds2012-08-011-1/+1
|\ | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | | Pull battery updates from Anton Vorontsov: "The tag contains just a few battery-related changes for v3.6. It's is all pretty straightforward, except one thing. One of our patches added thermal support for power supply class, but thermal/ subsystem changed under our feet. We (well, Stephen, that is) caught the issue and it was decided[1] that I'd just delay the battery pull request, and then will fix it up by merging upstream back into battery tree at the specific commit. That's not all though: another[2] small fixup for thermal subsystem was needed to get rid of a warning in power supply subsystem (the warning was not drivers/power's "fault", the thermal registration function just needed a proper const annotation, which is also done by a small commit on top of the merge. So, to sum this up: - The 'master' branch of the battery tree was in the -next tree for weeks, was never rebased, altered etc. It should be all OK; - Although, for-v3.6 tag contains the 'master' branch + merge + the warning fix. [1] http://lkml.org/lkml/2012/6/19/23 [2] http://lkml.org/lkml/2012/6/18/28" * tag 'for-v3.6' of git://git.infradead.org/battery-2.6: (23 commits) thermal: Constify 'type' argument for the registration routine olpc-battery: update CHARGE_FULL_DESIGN property for BYD LiFe batteries olpc-battery: Add VOLTAGE_MAX_DESIGN property charger-manager: Fix build break related to EXTCON lp8727_charger: Move header file into platform_data directory power_supply: Add min/max alert properties for CAPACITY, TEMP, TEMP_AMBIENT bq27x00_battery: Add support for BQ27425 chip charger-manager: Set current limit of regulator for over current protection charger-manager: Use EXTCON Subsystem to detect charger cables for charging test_power: Add VOLTAGE_NOW and BATTERY_TEMP properties test_power: Add support for USB AC source gpio-charger: Use cansleep version of gpio_set_value bq27x00_battery: Add support for power average and health properties sbs-battery: Don't trigger false supply_changed event twl4030_charger: Allow charger to control the regulator that feeds it twl4030_charger: Add backup-battery charging twl4030_charger: Fix some typos max17042_battery: Support CHARGE_COUNTER power supply attribute smb347-charger: Add constant charge and current properties power_supply: Add constant charge_current and charge_voltage properties ...
| * thermal: Constify 'type' argument for the registration routineAnton Vorontsov2012-07-311-1/+1
| | | | | | | | | | | | | | | | | | | | | | | | | | | | thermal_zone_device_register() does not modify 'type' argument, so it is safe to declare it as const. Otherwise, if we pass a const string, we are getting the ugly warning: CC drivers/power/power_supply_core.o drivers/power/power_supply_core.c: In function 'psy_register_thermal': drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default] include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *' Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org> Acked-by: Jean Delvare <khali@linux-fr.org>
* | Thermal: Add Hysteresis attributesDurgadoss R2012-07-251-0/+5
|/ | | | | | | | | | | | | | The Linux Thermal Framework does not support hysteresis attributes. Most thermal sensors, today, have a hysteresis value associated with trip points. This patch adds hysteresis attributes on a per-trip-point basis, to the Thermal Framework. These attributes are optionally writable. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* Thermal: Make Thermal trip points writeableDurgadoss R2012-07-251-3/+12
| | | | | | | | | | | | Some of the thermal drivers using the Generic Thermal Framework require (all/some) trip points to be writeable. This patch makes the trip point temperatures writeable on a per-trip point basis, and modifies the required function call in thermal.c. This patch also updates the Documentation to reflect the new change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: Rename generate_netlink_eventJean Delvare2012-01-231-2/+2
| | | | | | | | | | | | It doesn't seem right for the thermal subsystem to export a symbol named generate_netlink_event. This function is thermal-specific and its name should reflect that fact. Rename it to thermal_generate_netlink_event. Signed-off-by: Jean Delvare <khali@linux-fr.org> Acked-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: R.Durgadoss <durgadoss.r@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>
* thermal: make THERMAL_HWMON implementation fully internalJean Delvare2011-08-021-22/+0Star
| | | | | | | | | | | | | | | | | | | | | | | | | | THERMAL_HWMON is implemented inside the thermal_sys driver and has no effect on drivers implementing thermal zones, so they shouldn't see anything related to it in <linux/thermal.h>. Making the THERMAL_HWMON implementation fully internal has two advantages beyond the cleaner design: * This avoids rebuilding all thermal drivers if the THERMAL_HWMON implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or disabled. * This avoids breaking the thermal kABI in these cases too, which should make distributions happy. The only drawback I can see is slightly higher memory fragmentation, as the number of kzalloc() calls will increase by one per thermal zone. But I doubt it will be a problem in practice, as I've never seen a system with more than two thermal zones. Signed-off-by: Jean Delvare <khali@linux-fr.org> Cc: Rene Herman <rene.herman@gmail.com> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
* ACPI: Fix build for CONFIG_NET unsetRafael J. Wysocki2011-03-011-0/+8
| | | | | | | | | | | | | | | | | | | | | Several ACPI drivers fail to build if CONFIG_NET is unset, because they refer to things depending on CONFIG_THERMAL that in turn depends on CONFIG_NET. However, CONFIG_THERMAL doesn't really need to depend on CONFIG_NET, because the only part of it requiring CONFIG_NET is the netlink interface in thermal_sys.c. Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET and remove the dependency of CONFIG_THERMAL on CONFIG_NET from drivers/thermal/Kconfig. Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl> Acked-by: Randy Dunlap <randy.dunlap@oracle.com> Cc: Ingo Molnar <mingo@elte.hu> Cc: Len Brown <lenb@kernel.org> Cc: Stephen Rothwell <sfr@canb.auug.org.au> Cc: Luming Yu <luming.yu@intel.com> Cc: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
* Merge branch 'misc' into releaseLen Brown2011-01-121-10/+5Star
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