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authorLen Brown2019-05-13 19:59:00 +0200
committerThomas Gleixner2019-05-23 10:08:36 +0200
commitb2ce1c883df91a231f8138935167273c1767ad66 (patch)
tree558b6e49c32c90592911559f1001b80cc1657066 /drivers/hwmon
parentperf/x86/intel/cstate: Support multi-die/package (diff)
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thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages
Syntax update only -- no logical or functional change. In response to the new multi-die/package changes, update variable names to use the more generic thermal "zone" terminology, instead of "package", as the zones can refer to either packages or die. Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Cc: Zhang Rui <rui.zhang@intel.com> Link: https://lkml.kernel.org/r/b65494a76be13481dc3a809c75debb2574c34eda.1557769318.git.len.brown@intel.com
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