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| author | Zhang Rui | 2019-05-13 19:58:51 +0200 |
|---|---|---|
| committer | Thomas Gleixner | 2019-05-23 10:08:32 +0200 |
| commit | 32fb480e0a2cf1f71e4174d6477198c94dbc746c (patch) | |
| tree | e52c57e08b0e3dbc5e1e3108aaab800d99156125 /drivers/thermal | |
| parent | powercap/intel_rapl: Simplify rapl_find_package() (diff) | |
| download | kernel-qcow2-linux-32fb480e0a2cf1f71e4174d6477198c94dbc746c.tar.gz kernel-qcow2-linux-32fb480e0a2cf1f71e4174d6477198c94dbc746c.tar.xz kernel-qcow2-linux-32fb480e0a2cf1f71e4174d6477198c94dbc746c.zip | |
powercap/intel_rapl: Support multi-die/package
RAPL "package" domains are actually implemented in hardware per-die.
Thus, the new multi-die/package systems have mulitple domains
within each physical package.
Update the intel_rapl driver to be "die aware" -- exporting multiple
domains within a single package, when present. No change on single
die/package systems.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: linux-pm@vger.kernel.org
Link: https://lkml.kernel.org/r/9fcb4719aeb7efccf3bc75ed8dd559e46121649f.1557769318.git.len.brown@intel.com
Diffstat (limited to 'drivers/thermal')
0 files changed, 0 insertions, 0 deletions