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-rw-r--r--Documentation/devicetree/bindings/vendor-prefixes.txt6
1 files changed, 6 insertions, 0 deletions
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt
index 286f4e1e111f..708ff2504260 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.txt
+++ b/Documentation/devicetree/bindings/vendor-prefixes.txt
@@ -45,6 +45,7 @@ avia avia semiconductor
avic Shanghai AVIC Optoelectronics Co., Ltd.
axentia Axentia Technologies AB
axis Axis Communications AB
+bananapi BIPAI KEJI LIMITED
boe BOE Technology Group Co., Ltd.
bosch Bosch Sensortec GmbH
boundary Boundary Devices Inc.
@@ -159,6 +160,8 @@ iom Iomega Corporation
isee ISEE 2007 S.L.
isil Intersil
issi Integrated Silicon Solutions Inc.
+itead ITEAD Intelligent Systems Co.Ltd
+iwave iWave Systems Technologies Pvt. Ltd.
jdi Japan Display Inc.
jedec JEDEC Solid State Technology Association
karo Ka-Ro electronics GmbH
@@ -177,6 +180,7 @@ lg LG Corporation
libretech Shenzhen Libre Technology Co., Ltd
licheepi Lichee Pi
linaro Linaro Limited
+linksys Belkin International, Inc. (Linksys)
linux Linux-specific binding
lltc Linear Technology Corporation
lsi LSI Corp. (LSI Logic)
@@ -269,8 +273,10 @@ renesas Renesas Electronics Corporation
richtek Richtek Technology Corporation
ricoh Ricoh Co. Ltd.
rikomagic Rikomagic Tech Corp. Ltd
+riscv RISC-V Foundation
rockchip Fuzhou Rockchip Electronics Co., Ltd
rohm ROHM Semiconductor Co., Ltd
+roofull Shenzhen Roofull Technology Co, Ltd
samsung Samsung Semiconductor
samtec Samtec/Softing company
sandisk Sandisk Corporation